General description

Ti has low thermal and electrical conductivity. It is highly corrosion-resistant and has a high strength to weight ratio. A few angstroms thick layer of titania on the surface of Ti products makes its corrosion resistant.5 Ti foils could be employed as a substrate to grow arrays of hematite nanorods by hydrothermal method. A study reports pressure less sintering of SiC pieces and single crystals to Ti foils at 1500^oC. Ti foil may be applied as an interlayer, diffusion bonded during the self joining of Si₃N₄. Si₃N₄/Ti-foil/Si₃N₄.

Packaging

280 mg in rigid mailer

1.1 g in rigid mailer

Quantity

280 mg = 50 × 50 mm; 1.1 g = 100 × 100 mm