Ti has low thermal and electrical conductivity. It is highly corrosion-resistant and has a high strength to weight ratio. A few angstroms thick layer of titania on the surface of Ti products makes its corrosion resistant.5 Ti foils could be employed as a substrate to grow arrays of hematite nanorods by hydrothermal method. A study reports pressure less sintering of SiC pieces and single crystals to Ti foils at 1500oC. Ti foil may be applied as an interlayer, diffusion bonded during the self joining of Si3N4. Si3N4/Ti-foil/Si3N4.
280 mg in rigid mailer
1.1 g in rigid mailer
280 mg = 50 × 50 mm; 1.1 g = 100 × 100 mm